Boards Assembly.OEM

Boards Assembly.OEM(includs.ICT.ATE.AOI.X-RAY.Test)

● FPC(0.3~0.5 mm)

 - Camera Module

 - Mobile Phone Display Module

● PCB(0.6~0.8 mm)

 - SMART phone GPS Module、CF Card、Flash Disk

● PCB(1.0~1.4 mm)

 - Mobile Phone、Protable Data Terminal/ IP Camera、FPGA Product、DVR、Vedio HDD Player

● PCB(1.6mm~2.5mm)

 - IPC、POS、RAID System

SMT & DIP Lead Free Halogen Free Process

● 2004.4. Passed SONY EMCS Corporation Lead Free Process certification and started MP

● All SMT lines and DIP lines in factory phase in lead free process

● SMT POP (Package on Package) process phased in

● MES shop floor control system phased in

● Solder paste、 Steel plate tension 、 Material FIFO 、Material baking control system phased in

● Have the best PCB Layout design and recommentdation

New Product Trial Run Evaluation &design easy manufacturing feedback

● PCB Layout imporvement , feedback and recommendation

● Semi-finished goods、finished goods test fixtures manufacture recommendation

● Finished goods assembly, clip fixtures manufacture recommemdation

● Trail run report offering

Purchase Components for You

● Traditional Active、Passive Component

● SMD Active、Passive Component


● Packing material